Sun, Shenglin: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

Про збір коштів Детальніше

Підтримати

Книги
Статті (98)
Найпопулярніші
Перелік
- Перелік
- Таблиця

Efficient and Robust Syslog Parsing for Network Devices in Datacenter Networks

Zhang, Shenglin, Song, Lei, Zhang, Ming, Liu, Ying, Meng, Weibin, Bu, Jiahao, Yang, Sen, Sun, Yongqian, Pei, Dan, Xu, Jun, Zhang, Yuzhi

Журнал:

IEEE Access

Рік:

2020

Файл:

PDF, 2.54 MB

2020

Effects of various cross-linking agents on the physicochemical properties of starch/PHA composite films produced by extrusion blowing

Sun, Shenglin, Liu, Pengfei, Ji, Na, Hou, Hanxue, Dong, Haizhou

Журнал:

Food Hydrocolloids

Рік:

2017

Мова:

english

Файл:

PDF, 2.83 MB

english, 2017

Micromechanics of composite materials using multivariable finite element method and homogenization theory

Huiyu Sun, Shenglin Di, Nong Zhang, Changchun Wu

Журнал:

International Journal of Solids and Structures

Рік:

2001

Мова:

english

Файл:

PDF, 179 KB

english, 2001

Bending analysis of composite laminated plates using a partially hybrid stress element with interlaminar continuity

Yingqing Huang, Shenglin Di, Changchun Wu, Huiyu Sun

Журнал:

Computers & Structures

Рік:

2002

Мова:

english

Файл:

PDF, 221 KB

english, 2002

Coalbed Methane-bearing Characteristics and Reservoir Physical Properties of Principal Target Areas in North China

TANG Shuheng, SUN Shenglin, HAO Duohu, TANG Dazhen

Журнал:

Acta Geologica Sinica - English Edition (Wiley-Blackwell)

Рік:

2004

Мова:

english

Файл:

PDF, 505 KB

english, 2004

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effect of additives on copper electroplating profile for TSV filling

Zhu, Yunhui, Bian, Yuan, Sun, Xin, Ma, Shenglin, Cui, Qinghu, Zhong, Xiao, Chen, Jing, Miao, Min, Jin, Yufeng

Рік:

2012

Мова:

english

Файл:

PDF, 3.95 MB

english, 2012

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Process development and characterization of BCB-based redistribution layer (RDL) for silicon interposer application

Sun, Xin, Cui, Qinghu, Zhu, Yunhui, Ma, Shenglin, Chen, Jing, Miao, Min, Jin, Yufeng

Рік:

2012

Мова:

english

Файл:

PDF, 15.61 MB

english, 2012

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study of polyimide as sacrificial layer with O2 plasma releasing for its application in MEMS capacitive FPA fabrication

Ma, Shenglin, Li, Ying, Sun, Xin, Yu, Xiaomei, Jin, Yufeng

Рік:

2009

Мова:

english

Файл:

PDF, 544 KB

english, 2009

Effect of five saturated fatty acids on the properties of sweet-potato-starch-based films

Liu, Pengfei, Sun, Shenglin, Hou, Hanxue, Wang, Wentao, Dong, Haizhou

Журнал:

Journal of Applied Polymer Science

Рік:

2015

Мова:

english

Файл:

PDF, 574 KB

english, 2015

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - A new method to fabricate sidewall insulation of TSV using a parylene protection layer

Ji, Ming, Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Miao, Min, Jin, Yufeng

Рік:

2009

Мова:

english

Файл:

PDF, 1017 KB

english, 2009

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Bottom-up filling of Through Silicon Via (TSV) with Parylene as sidewall protection layer

Miao, Min, Zhu, Yunhui, Ji, Ming, Ma, Shenglin, Sun, Xin, Jin, Yufeng

Рік:

2009

Мова:

english

Файл:

PDF, 4.61 MB

english, 2009

Effect of the ways of adding stearic acid on properties of sweet potato starch and sweet-potato-starch-based films

Liu, Pengfei, Sun, Shenglin, Lu, Huiling, Hou, Hanxue, Dong, Haizhou

Журнал:

Starch - Stärke

Рік:

2016

Мова:

english

Файл:

PDF, 546 KB

english, 2016

Effects of fatty acids with different degree of unsaturation on properties of sweet potato starch-based films

Liu, Pengfei, Sun, Shenglin, Hou, Hanxue, Dong, Haizhou

Журнал:

Food Hydrocolloids

Рік:

2016

Мова:

english

Файл:

PDF, 1.27 MB

english, 2016

Mitochondria-Targeted Small-Molecule Fluorophores for Dual Modal Cancer Phototherapy

Luo, Shenglin, Tan, Xu, Fang, Shengtao, Wang, Yu, Liu, Tao, Wang, Xin, Yuan, Yi, Sun, Huiqin, Qi, Qingrong, Shi, Chunmeng

Журнал:

Advanced Functional Materials

Рік:

2016

Мова:

english

Файл:

PDF, 2.58 MB

english, 2016

Cervical Neurofibromatosis With Tetraplegia

Wu, Fengliang, Zhang, Li, Liu, Zhongjun, Sun, Yu, Li, Feng, Wang, Shenglin, Wei, Feng

Журнал:

Spine

Рік:

2012

Мова:

english

Файл:

PDF, 802 KB

english, 2012

Crucial role of support in glucose selective conversion into 1,2-propanediol and ethylene glycol over Ni-based catalysts: A combined experimental and computational study

Tan, Zhichao, Shi, Lei, Zan, Yifan, Miao, Gai, Li, Shenglin, Kong, Lingzhao, Li, Shengang, Sun, Yuhan

Журнал:

Applied Catalysis A: General

Рік:

2018

Мова:

english

Файл:

PDF, 742 KB

english, 2018

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications

Sun, Yunheng, Cai, Han, Li, Jiwei, Ma, Shenglin, Jin, Yufeng, Wang, Wei, Chen, Jing, Miao, Min, Hu, Liulin, He, Shuwei

Рік:

2018

Мова:

english

Файл:

PDF, 821 KB

english, 2018

Lisa: inferring transcriptional regulators through integrative modeling of public chromatin accessibility and ChIP-seq data

Qin, Qian, Fan, Jingyu, Zheng, Rongbin, Wan, Changxin, Mei, Shenglin, Wu, Qiu, Sun, Hanfei, Brown, Myles, Zhang, Jing, Meyer, Clifford A., Liu, X. Shirley

Журнал:

Genome Biology

Рік:

2020

Файл:

PDF, 1.98 MB

2020

Rotational behavior and modeling of bolted glulam beam-to-column connections with slotted-in steel plate

Sun, Xiaoluan, Qu, Yiheng, Liu, Weiqing, Lu, Weidong, Yuan, Shenglin

Журнал:

Advances in Structural Engineering

Рік:

2020

Файл:

PDF, 2.14 MB

2020

Effects of fatty acids with various chain lengths and degrees of unsaturation on the structure, physicochemical properties and digestibility of maize starch-fatty acid complexes

Sun, Shenglin, Jin, Yuzhen, Hong, Yan, Gu, Zhengbiao, Cheng, Li, Li, Zhaofeng, Li, Caiming

Журнал:

Food Hydrocolloids

Рік:

2021

Файл:

PDF, 4.28 MB

2021

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers

Sun, Yunheng, Jin, Yufeng, Lian, Tingting, Ma, Shenglin, Yang, Yuchi, Wang, Wei, Hu, Liulin, He, Shuwei

Рік:

2020

Файл:

PDF, 550 KB

2020

The influence of HVAF powder feedstock characteristics on the sliding wear behaviour of WC–NiCr coatings

Shenglin Liu, Dongbai Sun, Zishuan Fan, Hong-ying Yu, Hui-min Meng

Журнал:

Surface and Coatings Technology

Рік:

2008

Мова:

english

Файл:

PDF, 1.49 MB

english, 2008

The antiemetic effects of magnetotherapy plus granisetron hydrochloride versus granisetron hydrochloride in patients with chemotherapy

Yongjun Zhang, Shenglin Ma, Aiqin Zhang, Yan Sun, Wenlong Bao

Журнал:

The Chinese-German Journal of Clinical Oncology

Рік:

2010

Мова:

english

Файл:

PDF, 224 KB

english, 2010

Affecting factors of preferential flow in the forest of the Three Gorges area, Yangtze River

Jinhua Cheng, Hongjiang Zhang, Youyan Zhang, Yuhu Shi, Fan He, Shenglin Qi, Yanhong Sun

Журнал:

Frontiers of Forestry in China

Рік:

2007

Мова:

english

Файл:

PDF, 421 KB

english, 2007

Micromechanics of braided composites via multivariable FEM

Huiyu Sun, Shenglin Di, Nong Zhang, Ning Pan, Changchun Wu

Журнал:

Computers & Structures

Рік:

2003

Мова:

english

Файл:

PDF, 224 KB

english, 2003

Flexible Hybrid Paper Made of Monolayer Co3O4 Microsphere Arrays on rGO/CNTs and Their Application in Electrochemical Capacitors

Changzhou Yuan, Long Yang, Linrui Hou, Jiaoyang Li, Yaxin Sun, Xiaogang Zhang, Laifa Shen, Xiangjun Lu, Shenglin Xiong, Xiong Wen (David) Lou

Журнал:

Advanced Functional Materials

Рік:

2012

Мова:

english

Файл:

PDF, 1.10 MB

english, 2012

Application Results of 3-D Seismic Exploration Technology in Coal Mines

SUN Shenglin, WU Xizun

Журнал:

Acta Geologica Sinica - English Edition (Wiley-Blackwell)

Рік:

2004

Мова:

english

Файл:

PDF, 811 KB

english, 2004

Distribution Characteristics of Sulfur and the Main Harmful Trace Elements in China's Coal

TANG Shuheng, SUN Shenglin, QIN Yong, JIANG Yaofa, WANG Wenfeng

Журнал:

Acta Geologica Sinica - English Edition (Wiley-Blackwell)

Рік:

2008

Мова:

english

Файл:

PDF, 733 KB

english, 2008

Concomitant chemoradiotherapy using pemetrexed and carboplatin for unresectable stage III non-small cell lung cancer (NSCLC): Preliminary results of a phase II study

Xu, Yaping, Ma, Shenglin, Ji, Yongling, Sun, Xiaojiang, Jiang, Hao, Chen, Jianxiang, Du, Xianghui, Zheng, Yuanda, Qiu, Guoqin

Журнал:

Lung Cancer

Рік:

2011

Мова:

english

Файл:

PDF, 164 KB

english, 2011

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Parametric study, modeling of etching process and application for tapered through-silicon-via

Ma, Shenglin, Zhong, Xiao, Bian, Yuan, Sun, Xin, Zhu, Yunhui, Chen, Jing, Miao, Min, Jin, Yufeng

Рік:

2012

Мова:

english

Файл:

PDF, 1.12 MB

english, 2012

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Process development of a stacked chip module with TSV interconnection

Zhong, Xiao, Ma, Shenglin, Zhu, Yunhui, Bian, Yuan, Sun, Xin, Cui, Qinghu, Miao, Min, Chen, Jing, Jin, Yufeng

Рік:

2012

Мова:

english

Файл:

PDF, 2.66 MB

english, 2012

[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Understanding effect of additives in copper electroplating filling for through silicon via

Miao, Min, Zhu, Yunhui, Bian, Yuan, Sun, Xin, Ma, Shenglin, Cui, Qinghu, Zhong, Xiao, Fang, Runiu, Chen, Jing, Jin, Yufeng

Рік:

2012

Мова:

english

Файл:

PDF, 342 KB

english, 2012

Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives

Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Chen, Jing, Miao, Min, Jin, Yufeng

Журнал:

Microelectronic Engineering

Рік:

2014

Мова:

english

Файл:

PDF, 973 KB

english, 2014

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Electrical characterization of sidewall insulation layer of TSV

Xin Sun,, Ming Ji,, Shenglin Ma,, Yunhui Zhu,, Wenping Kang,, Min Miao,, Yufeng Jin,

Рік:

2010

Мова:

english

Файл:

PDF, 2.02 MB

english, 2010

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Fabrication and in-situ evaluation of copper TSV interconnection

Ma, Shenglin, Zhu, Yunhui, Sun, Xin, Miao, Min, Chen, Jin, Jin, Yufeng

Рік:

2011

Мова:

english

Файл:

PDF, 2.16 MB

english, 2011

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Design and fabrication of a TSV interposer for SRAM integration

Zhu, Yunhui, Ma, Shenglin, Cui, Qinghu, Kang, Wenping, Zhu, Zhiyuan, Sun, Xin, Wang, Guanjiang, Zhang, Mengmeng, Chen, Jing, Miao, Min, Jin, Yufeng

Рік:

2011

Мова:

english

Файл:

PDF, 2.60 MB

english, 2011

[IEEE 2012 3rd International Conference on System Science, Engineering Design and Manufacturing Informatization (ICSEM) - Chengdu, China (2012.10.20-2012.10.21)] 2012 3rd International Conference on System Science, Engineering Design and Manufacturing Informatization - Web service discovery and composition based on process model

Sun, Xingping, Kang, Hongwei, Zhou, Hua, Yang, ShengLin, Shen, Yong, Duan, Qing

Рік:

2012

Мова:

english

Файл:

PDF, 119 KB

english, 2012

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC

Shenglin Ma,, Xin Sun,, Yunhui Zhu,, Qinghu Cui,, Yufeng Jin,, Xiaomei Yu,, Jing Chen,, Min Miao,

Рік:

2011

Мова:

english

Файл:

PDF, 2.53 MB

english, 2011

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A wafer level through-stack-via integration process with one-time bottom-up copper filling

Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Fang, Runiu, Zhong, Xiao, Bian, Yuan, Guan, Yong, Chen, Jing, Miao, Min, Jin, Yufeng

Рік:

2014

Мова:

english

Файл:

PDF, 1.27 MB

english, 2014

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Process development of multi-layer stacked chip module

Ma, Shenglin, Sun, Xin, Zhu, Yunhui, Kang, Wenping, Cui, Qinghu, Miao, Min, Chen, Jin, Jin, Yufeng

Рік:

2011

Мова:

english

Файл:

PDF, 1.78 MB

english, 2011

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Development of a through-stack-via integrated SRAM module

Yunhui Zhu,, Xin Sun,, Shenglin Ma,, Qinghu Cui,, Xiao Zhong,, Yuan Bian,, Meng Chen,, Yongqiang Xiao,, Runiu Fang,, Zhenhua Liu,, Zhiyuan Zhu,, Xin Gong,, Jing Chen,, Min Miao,, Wengao

Рік:

2012

Мова:

english

Файл:

PDF, 1.25 MB

english, 2012

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Electrical modeling, simulation and SPICE model extraction of TSVs in silicon interposer

Xin Sun,, Yunhui Zhu,, Shenglin Ma,, Min Miao,, Jing Chen,, Yufeng Jin,

Рік:

2011

Мова:

english

Файл:

PDF, 1.20 MB

english, 2011

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - A TSV last integration approach with wafer level pre-patterned adhesive bonding

Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Cui, Qinghu, Zhong, Xiao, Bian, Yuan, Chen, Jing, Miao, Min, Jin, Yufeng

Рік:

2012

Мова:

english

Файл:

PDF, 5.90 MB

english, 2012

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Design and optimization of redistribution layer (RDL) on TSV interposer for high frequency applications

Cui, Qinghu, Sun, Xin, Zhu, Yunhui, Ma, Shenglin, Chen, Jing, Miao, Min, Jin, Yufeng

Рік:

2011

Мова:

english

Файл:

PDF, 5.39 MB

english, 2011

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Development and characterization of a through-multilayer TSV integrated SRAM module

Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Fang, Runiu, Zhong, Xiao, Bian, Yuan, Chen, Meng, Chen, Jing, Miao, Min, Lu, Wengao, Jin, Yufeng

Рік:

2013

Мова:

english

Файл:

PDF, 2.38 MB

english, 2013

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Design and process development of a stacked SRAM memory chip module with TSV interconnection

Ma, Shenglin, Sun, Xin, Zhu, Yunhui, Zhu, Zhiyuan, Cui, Qinghu, Chen, Meng, Xiao, Yongqiang, Chen, Jing, Miao, Min, Lu, Wengao, Jin, Yufeng

Рік:

2012

Мова:

english

Файл:

PDF, 1.76 MB

english, 2012

[IEEE 2012 International Conference on Business Computing and Global Informatization (BCGIN) - Shanghai, China (2012.10.12-2012.10.14)] 2012 Second International Conference on Business Computing and Global Informatization - Research on Web Service-Based Virtual Enterprise Model Architecture

Yang, Shenglin, Kang, Hongwei, Liang, Zhihong, Sun, Xingping, Shen, Yong, Duan, Qing

Рік:

2012

Мова:

english

Файл:

PDF, 157 KB

english, 2012

[IEEE 2013 3rd International Conference on Consumer Electronics, Communications and Networks (CECNet) - Xianning, China (2013.11.20-2013.11.22)] 2013 3rd International Conference on Consumer Electronics, Communications and Networks - A study and instantiation of executable domain-specific modeling

Duan, Qing, Liu, Junhui, Liang, Zhihong, Sun, Xingping, Kang, Hongwei, Yang, ShengLin

Рік:

2013

Мова:

english

Файл:

PDF, 488 KB

english, 2013

[IEEE 2012 3rd International Conference on System Science, Engineering Design and Manufacturing Informatization (ICSEM) - Chengdu, China (2012.10.20-2012.10.21)] 2012 3rd International Conference on System Science, Engineering Design and Manufacturing Informatization - Research on Web service-based virtual enterprise integration framework

Yang, Shenglin, Kang, Hongwei, Zhou, Hua, Sun, Xingping, Shen, Yong, Duan, Qing

Рік:

2012

Мова:

english

Файл:

PDF, 101 KB

english, 2012

[IEEE 2012 International Conference on Business Computing and Global Informatization (BCGIN) - Shanghai, China (2012.10.12-2012.10.14)] 2012 Second International Conference on Business Computing and Global Informatization - Research on Web Service-Based Virtual Enterprise Process Model

Sun, Xingping, Kang, Hongwei, Liang, Zhihong, Yang, Shenglin, Shen, Yong, Duan, Qing

Рік:

2012

Мова:

english

Файл:

PDF, 162 KB

english, 2012